Reference revision · 2026-09-27
Open the matrix material, follow its Cure kinetics model, then select Resin viscosity model. Choose Castro–Macosko epoxy viscosity, edit its inputs, or choose None to disconnect it. Existing epoxy cure records gain this new link once; existing None and calibrated choices are retained.
The same local cure conversion drives two paths: temperature + cure → viscosity → resin flow; and cure → CHILE resin modulus → micromechanics → ply and laminate stiffness.
| Input | Example | Meaning |
|---|---|---|
| Reference uncured viscosity | 1 Pa·s | Viscosity at zero conversion and the reference temperature. Illustrative, not a product calibration. |
| Viscosity reference temperature | 80 °C | Temperature at which the reference uncured viscosity is specified. |
| Viscosity activation energy | 45 kJ/mol | Arrhenius temperature dependence; illustrative coefficient. |
| Viscosity gel conversion | 0.55 fraction | Flow stops at this conversion. Match the resin kinetics and CHILE gel inputs when fitting the material. |
| Viscosity cure coefficient C1 | 2 — | Positive fitted exponent constant. |
| Viscosity cure coefficient C2 | 0 — | Nonnegative fitted conversion coefficient. |
| Viscosity reporting ceiling | 1000000000000 Pa·s | Numerical plotting ceiling; the gelled resin is flow-inactive, not a flowing liquid at this viscosity. |
Equation and limits
η = ηref exp[(Eη/R)(1/T − 1/Tref)] [αg/(αg − α)]^(C1 + C2 α). Temperatures are kelvin; conversion is a fraction. Flow ceases at gel. The plotted viscosity ceiling is a numerical reporting value, not post-gel liquid behavior.
Defaults are illustrative screening inputs, not measurements for a branded resin. Match the viscosity, kinetics and modulus gel parameters during calibration. This formulation does not include shear thinning, vitrification or degradation. CHILE supplies elastic stiffness independently; viscosity does not determine modulus. Void reduction remains one-way postprocessing and does not alter the structural fiber fraction or thickness.
IACMI/Purdue report: Castro–Macosko viscosity, p.9After Run, Thermal → Solved thermal field offers Epoxy viscosity, Epoxy pre-gel flow active, resin modulus and lamina E1/E2/G12. Refine the thermal output interval to resolve rapid cure. Roller and gel-crossing events are retained by the flow integrations.