Training & Exercise Manual · 03.58

03.58 · Pultrusion: thick-section cure lag and loaded stiffness

Online chapter revision 2026-10-05. Complete download edition 2026-10-03.

ProcessingChapter concept map · not simulation results
INPUTBoundary history
MODELHeat + material state
OUTPUTHistory + gradients

In a pultrusion study, pulling speed connects a position along the die to the time experienced by a moving material section. The exercise uses that relationship to examine residence time, heating and cure, with a structural comparison only where the selected simulation supports that transfer.

Open this exercise in Workbench

Used model inputs for 03.58 · Pultrusion: thick-section cure lag and loaded stiffness
Used records in the standard workflow layout. Hidden records remain in Workbench. This diagram is not a calculated result.
Physical process schematic: 03.58 · Pultrusion: thick-section cure lag and loaded stiffness
Material travels through the supplied heating and cooling die zones. Pulling speed sets residence time; inspect outlet temperature and cure where available. Conceptual setup, not to scale or a solved result. The live process view remains available in Workbench.

Prepare the baseline

Check the die length, inlet state, pulling speed and boundary stations before changing between length and time views. Keep the intended coordinate basis fixed while comparing speeds. Record the computed outlet state for each run; a prescribed die temperature is not an imposed core temperature or a guarantee of complete cure.

Worked procedure

1. Run the 4 mm profile at 0.1 m/min in the multi-zone die.

2. Compare the 2 mm baseline, keeping pulling speed and temperature stations unchanged.

3. Compare surface/core conversion and temperature with structural strain under the same Nx.

4. Repeat the thick profile at half speed. Separate the mechanical thickness effect from changes in cure-dependent stiffness.

Review checkpoints

The same resultant on twice the thickness gives a different nominal stress.

Do not attribute every strain change to cure; thickness also changes stiffness.

Model limits

Hypothetical teaching process using existing T700/epoxy laminate properties and illustrative cure parameters, not a calibrated pultrusion recipe. Constant-speed moving section; no axial conduction, impregnation, leakage, die thermal mass or pulling-force prediction. Use Thermal Run, not batch-cycle optimization. Sequential outlet-state structural screening under a prescribed resultant; no pulling force, die friction, impregnation or load feedback into the thermal solution.

Interpret the comparison

Explain the process result using the reported residence time and surface/core histories. For coupled variants, also record the actual state and stiffness passed into the structural calculation. Separate changes caused by section thickness or applied load from changes caused by cure, and do not infer an acceptable production speed without calibrated requirements.

How information passes between models

Micro → Laminates: Predicted ply stiffness, strength, density and expansion properties.

Laminates → Geometry: Ply angles and thicknesses, stiffness, mass and ply properties.

Materials → Equipment: Constituent stiffness, strength, density and thermal / moisture properties.

Materials → Micro: Constituent stiffness, strength, density and thermal / moisture properties.

Mechanical → Simulation: SIMULATION selects this case and its analysis model; the case owns its applicable cycle and input references.

Laminates → Mechanical: Ply angles and thicknesses, stiffness, mass and ply properties.

Geometry → Mechanical: Part shape and dimensions, thickness or section definition, and model-specific geometric inputs. Each selected case consumes only the dimensions its model supports.

Thermal → Simulation: SIMULATION selects this case and its analysis model; the case owns its applicable cycle and input references.

Laminates → Thermal: Ply angles and thicknesses, stiffness, mass and ply properties.

Geometry → Thermal: Part shape and dimensions, thickness or section definition, and model-specific geometric inputs. Each selected case consumes only the dimensions its model supports.

Equipment → Thermal: Linked lasers, IR/UV lamps, heaters, coolers and molds: dimensions, radiant power or prescribed temperature / heat flux, contact conductance, body and surface materials. Each boundary keeps its own placement, side and exposure.

Models → Micro: Applied model assignment: Halpin–Tsai. Model parameters and formulation are used by Micro.

Models → Mechanical: Applied model assignment: CLT · Linear static with failure indices. Model parameters and formulation are used by Mechanical.; Maximum stress

Models → Thermal: Applied model assignment: 1D pultrusion thermal cure. Model parameters and formulation are used by Thermal.

Further reading and evidence

Review the recorded validation scope. Retain the original inputs and solver notices with the results. Representative teaching data are not design allowables.

References and source sections

References are retained with the formulations they support. Software instructions describe implementation scope; a cited source does not establish independent validation of a CDS calculation.

Detailed online sources